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LOCTITE ECCOBOND UF 3811 is a reworkable epoxy substrate designed specifically for CSP and BGA applications. This low viscosity material can flow at room temperature without the need for additional preheating. It quickly solidifies at moderate temperatures, minimizing pressure on other components. After curing, this material has a high glass transition temperature while maintaining flexibility to protect solder joints during thermal cycling and drop testing.

• Room temperature flowability

• Low viscosity materials flow at room temperature without the need for additional preheating

• High glass transition temperature while maintaining flexibility to protect solder joints during thermal cycling and drop testing

• Rapid curing at medium temperature to reduce stress on other components