LOCTITE ECCOBOND FP4450HF
Loctite ECCOBOND FP4450HF (known as HYSOL FP4450HF) is designed for exposed semiconductor devices and has properties such as low viscosity, high purity, moisture resistance, and high temperature resistance. The charged equipment PCT1000h has no failure. Very suitable for chip and gold wire fill applications.
| Technical information | |
| Color | black |
| Viscosity | 32,000mPa·s |
| Specific gravity@ 25.0 °C | one point seven nine |
| Curing method | heating |
| Curing time | 30 minutes @ 125°C plus90 minutes @ 165°C |
| Glass transition temperature (Tg) | 164 °C |
| Thermal expansion coefficient (40 to 120 ° C) | 21ppm/°C |
| Thermal expansion coefficient (190 to 220 ° C) | 72ppm/°C |
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