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LOCTITE 3563 is a fast curing, fast flowing liquid epoxy resin designed for use as a capillary flow bottom filling for packaging ICs, such as CSP and BGA. Its rheological design allows it to penetrate gaps as small as 25 μ m. After complete curing, it minimizes the induced stress at the solder joints to the greatest extent possible, thereby improving the thermal cycling performance.

• Single component - no need to mix

• Fast flowing epoxy liquid

• Production - High speed curing